LinearScan Process Overview

"These simple, intrinsically uniform steps are repeated until the desired amount of material is removed."

The LinerScan process is intrinsically uniform and size independent. All areal elements in the wafer experience the same chemical and transport environment. To uniformly remove material off the surface of a substrate, a sequence of simple steps is repeated until the desired removal amount is reached.

 

Notice that throughout the entire process, reactants arrive from below and byproducts leave the reaction zone through the sides, so no element in the wafer surface has to have its byproducts or reactants travel more that other elements, making the process intrinsically uniform. See Fig. 1 for a schematic representation of these sequence of steps.

WaveEtch LinearScan steps schemcatic representation. Fig. 1. WaveEtch LinearScan steps schemcatic representation.

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