WaveEtch FAQ

Here we try to anticipate or share questions that our users and potential customer may have regarding our systems. If you do not find the answer you are looking for, please do not hesitate to contact us directly. We will be happy to talk to you about your application and answer all your questions.

Even though all WaveEtch tools perform the same process steps, they differ in the level of automation and their capacity to handle very large or very thin wafers. At the high end, the 456-G2 integrates up to three process modules with a semiconductor fab standard, full-function EFEM (Equipment Front End Module). This configuration offers high throughput as well as easy fab automation system integration (GEMS, SECS II). In the middle reside the 212me and the 212me2. These workhorses are compact and cost effective without sacrificing automation, throughput or capability. The come equipped with one or two miniEFEMs that can handle substrates up to 8: in diameter. They can also be fully fab-compatible and offer the full range of options and capabilities of the WaveEtch family. At the most practical and cost effective end we have the 112G. This no-nonsense tool can do the same process as any other of its siblings, but it is manual load-manual unload. It is still dry-in-dry-out, with the only difference being in its load unload mode. Please do not hesitato to contact us to discuss your process needs and answer all your questions.