1-12" substrates. This
is achieved, as with all other SSUWP™ systems, without disturbing
or contaminating the unprocessed side of the substrates.True single sided wet processing has great
implications on the development of new processes or devices (i.e.
optoelectronics, lasers, smart cards, flash devices, MEMS, and
hybrid integration), and on overall production cost reduction.
A unique feature of the WaveEtch™
family is that they can also automate processing of cut die substrates,
such as CCD or focal plane arrays.
The WaveEtch™ family can process a
wide variety of materials (i.e. InP, GaAs, Si, Ge, among others),
and substrate types and sizes. Thanks to its patented LinearScan™
(LST) and Dynamic Confinement Technology (DCT), typical material
removal uniformity (TTV) is better than 1%.
Depending on the process, a WaveEtch™ system can have throughput
of over a hundred wafers an hour. Also important, the acquisition
cost, cost of ownership, and chemical consumption of the WaveEtch™
systems is typically a fraction of other equivalent tools.
Let us help you determine
which WaveEtch™ configuration best suits your needs.
Explore what else a WaveEtch™ system can do
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