1-12" substrates. This is achieved, as with all other WaveEtch™ systems, without disturbing or contaminating the unprocessed side of the substrates and without the need for any type of protection of the non-process side. True single sided wet processing has great implications on the development of new processes or devices (i.e. optoelectronics, solar, lasers, smart cards, flash devices, MEMS, hybrid and 3D integration), and on overall cost reduction.
A unique feature of the WaveEtch™ family is that they can also automate processing of cut die substrates, such as CCD or focal plane arrays.
The WaveEtch™ family can process a wide variety of materials (i.e. InP, GaAs, Si, Ge, among others), and substrate types, shapes, and sizes. Thanks to its patented LinearScan™ and Dynamic Confinement Technologies, typical material removal uniformity (TTV) is better than 1% for most applications.
Depending on the process, WaveEtch™ systems can have throughputs of hundreds of wafers per hour. Also important, the acquisition cost, cost of ownership, and chemical consumption of the WaveEtch™ systems is typically a fraction of other equivalent tools.
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