Designed for efficiency and performance; it has all the capability of its larger siblings, packaged in a more compact semi-automated platform. Geared toward research and low throughput production applications, the WaveEtch™ 112G will fit perfectly in either research or fab environments.
The system can process, in its different configurations, wafers ranging from 25 to 300 mm, as well as pieces or oddly shaped substrates.
The WaveEtch™112G comes ready to work right out of the box. You will be ready to thin, stress relieve, pattern, or perform any other wet processes in minutes. More importantly, the 112G offers the same unsurpassed uniformity (sub-1% in most thinning and stress relief applications!), reduced chemical and water usage; as well as the lowest cost of ownership of any wet processor in the market.
All WaveEtch™ systems can process and handle wafers down to 10 µm, or even thinner in some applications. So, if thinning, stress relief, wafer cleaning, or any other single-sided wet process is in your future, please contact us for more information.
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