| WaveEtch™
thinning performance
It
is now possible to thin semiconductor wafers automatically
and cost effectively with MATECH’s WaveEtch™ LinearScan™ Processor.
Substrates up to 12” can be thinned down to 10µm with
typical TTV of 2% or less. The WaveEtch system allows reliable
dry-in-dry-out, fully automated wet etching of thin substrates.
Silicon,
InP, GaAs, as well as most semiconductor wafers can be safely
handled and thinned down automatically with the WaveEtch™
system. MATECH’s patented LinearScan™ technology makes it
possible to etch substrates precisely and accurately, while
the system’s robotics gently handle the fragile wafers in
and out of their cassettes or flat-packs throughout the process.
The
WaveEtch™ system incorporates an advanced chemical handling
subsystem capable of metering, mixing, recirculating, recycling,
and managing multi-component solutions from bottles or bulk
delivery systems.
The
WaveEtch™ is also friendly to the environment. In virtually
all processes, it uses a fraction of the chemicals that would
be consumed by conventional spin, spray or wet bench technologies.
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