This page will help you get familiarized with MATECH's WaveEtch™ systems. Explore the article below to help you understand MATECH's LinearScan™ technology and how it sets the WaveEtch™ apart from other wet tools.

Extending process flexibility for single-sided wet etch

Despite the success of some dry-etching processes, wet etching remains a staple in semiconductor device fabrication, as well as in many other related technologies, such as MEMS and photovoltaics manufacturing. Wet etch processes are common both in device formation as well as in the metallization and packaging areas of the semiconductor process line.

New WaveEtch™ LinearScan™ etching technology provides high uniformity as well as single-sidedness on ultra-thin large substrates. It also provides a consistent and uniform supply of chemicals throughout the liquid-solid interface while making available an orthogonal path for the byproducts, such as gases and vapors. The fact that every surface element is exposed to the same chemical and transport environment makes the process intrinsically uniform. The boundary layer is not subject to speed gradients, convection, or other transport-related gradients that may cause variations in its thickness and its concomitant impact on uniformity. The system eliminates virtually all transport-related and centrosymmetrical nonuniformities, which plague spin/spray or immersion processes.

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