| WaveEtch™
pattern etching performance
MatechTM's
new WaveEtchTM system introduces two critical advances in
wet processing technology. The WaveEtch™ utilizes Linear
Scan™* wet processing and Dynamic Confinement™*
technologies to dramatically improve etching performance.
The Linear Scan provides a uniform and continuously replenished
liquid film for etching that automatically transports used
reactants and heat away from the substrate, resulting in unparalleled
wet processing uniformity. Combined with Dynamic Confinement,
a technology that protects the back side of the substrate,
the new WaveEtch™ is the perfect tool for your single
sided pattern etching applications. The figure and analysis
below show the quality that can be achieved on a uniform,
sub micron, line-space pattern with a WaveEtch™.
Figure
1
Pattern Depth on 75mm Wafer |
| These
new technologies are implemented in a fully automated, dry-in-dry-out,
cassette-to-cassette processing system. The WaveEtch™
can be configured to work with substrate sizes from 1 to 6
inches and its chemical handling unit can be configured with
up to seven channels, providing maximum flexibility.
Contact Matech™ now to increase
your wet processing quality and yield!
*
Patent Pending |
