| WaveEtch™
wet processing performance
Our latest data show that the WaveEtch™
system is the ideal tool for thinning nitride films, as it
achieves process uniformities under 1%. During the removal
of 800 Å of plasma nitride, the WaveEtch™ yields
a film thickness standard deviation of 0.7%! This performance
offers cost, quality, and yield benefits in the production
of your latest devices. In addition, it allows for the introduction
of advanced process steps due to its true single-sided capabilities.
Figure
1
Thickness of Silicon Nitride
Film on 75mm Wafer |
