• MATECH President and CEO delivers informational talk at Levitronix User Conference 2011

Dr. Ricardo Fuentes, founder of MATECH is to deliver an informational lecture at the Levitronix User Conference 2011, to be hosted in Dallas, TX. The conference will feature more than 20 speakers from seven nations across the globe.

MATECH's conference paper can be retrieved here.

  • MATECH releases megasonic module for all WaveEtch™ systems

A megasonic module compatible with all G-series WaveEtch™ systems has been made available as an option.

The addition of megasonics allows for much higher throughput by speeding up most chemical processes and rinsing steps. The WaveEtch™ system's surface engineering capabilities are also enhanced by the addition of megasonics. With this, WaveEtch™ systems open up new possibilities in the realms of texturing, cleaning, surface conditioning, and stress relief.

  • WaveEtch™ systems now available with non-contact options

MATECH has again extended process possibilities for customers by offering their WaveEtch™ line of tools with a non-contact option. This option still allows for 100% process exposure for the front side, while keeping the back side of the substrate fully isolated from any chemicals or chemical vapors.

Ask your local MATECH representative or contact us to discuss how this may enhance your process capabilities with a WaveEtch™ wet processor.

  • Top optoelectronic manufacturer acquires WaveEtch™ 112-G

Among MATECH's first customers to receive the recently released WaveEtch 112-G is a foremost optoelectronics manufacturer and research leader.

  • The WaveEtch 112-G Release

MATECH is proud to announce the release of the newest member of its WaveEtch™ family of single-sided wet processors: The WaveEtch™ 112-G System.

Find out more about the WaveEtch™ 112-G System.

 


• THINNING
• STRESS RELIEF
• WAFER CLEANING
• PATTERN ETCH

• 3-D INTEGRATION
• PACKAGING
• MEMS
• BUMPED WAFERS
• SOI

copyright: Materials and Technologies Corp. info@matech.com