MATECH
Consulting and Services Division
Providing
Consulting, Product and Process Development Services to our Customers
for over 10 years
The following is a representative—but
not all-inclusive—outline of the services and expertise
that MATECH places at the disposal of its customers. It is intended
to serve as a basis for our customers to assess our suitability
to become part of their solutions team and a resource onto which
to draw upon for its materials process and product development
needs.
SERVICES
AND TECHNOLOGIES OUTLINE
Isotropic etching (HF-based
chemistries) for membrane formation, stress relief, surface damage
removal, and for many other applications.
Anisotropic etching (KOH, EDP,
Ethanolamine, TMAH, hydroxide and other specialty chemistries)
for MEMS and microsystems fabrication, membrane fabrication, device
patterning, gratings, optoelectronic and optical applications,
among others.
Substrates and parts of up to
18” in diameter, or larger by special arrangements.
HF-based etching and thinning
of glass and quartz substrates and parts for stress relief, surface
damage relief, surface modification, among others.
Chemical glass machining. Near net shape formation of glass or
quartz optics and other materials. This technology avoids machining
and the encompassing surface damage. It can also be faster and
more economical than conventional grinding.
Substrates and parts of up to
18” in diameter, or larger by special arrangements.
Silicon substrate thinning down
to 50um (down to 10um in some cases) with our WaveEtch™
systems. Please refer to our WaveEtch web page for process and
substrate specifications.
Thinning is done single sided, so devices or features on the non-process
side are untouched during the process. Thinning can be done as
a last step before packaging. Application examples are CCDs, focal
plane arrays, memory, high frequency-high power devices, among
others.
Wafers and substrates up to 8” in diameter can now be handled,
with 12” capability to be announced in the near future.
Glass, quartz, and other materials
can also be thinned
Single sided Silicon, InP, GaAs,
InGaAs, glass, quartz wet etch patterning
Conventional immersion etching
also available for patterning applications.
Form mesa etch, vias, trench,
gratings, MEMS, etc.
Freestanding formation of membranes
in many materials, such as SiC, SiN, AlGaN, GaN, diamond, dimond-like
carbon (DLC), and many others.
Both isotropic single sided
etching (See Chandra below) where only one side of the substrate
is exposed to the chemicals, or conventional anisotropic immersion
etching are available for membrane and free standing thin film
structures fabrication.
See
NASA’s Chandra in our news page, or visit NASA's Chandra
web page. All of its gratings were fabricated with one of
our RotoEtch™ systems by MIT’s Space Nanotechnology
Laboratory under contract by NASA.
Advanced etching processes for
demanding applications. Please contact us to discuss your needs.
These process open the door for the fabrication of unconventional
structures or structures by unconventional means. Mechanical machining
can be avoided in the fabrication of intricate Si parts and all-chemical
net shape fabrication is possible.
Wafers with very accurate and
precise holes and other features, etched glass structures, among
others are parts that MATECH fabricates or can develop the processes
for our customer’s in hose manufacture.
MATECH has over 10 years of
experience using the processes outlined above, developing and
tailoring them to specific customer fabrication needs. MATECH
can also integrate the above with other related processes such
as lithography, dry etching, and deposition, among other, to become
part of an integrated solution for our customers.
MATECH Automation and Control
Group can develop, consult for, or assist our customers in designing,
prototyping, and manufacturing automation and electronic control
systems. MATECH can design, re-design, modernize (i.e. SMT, microprocessor-based
controllers, etc.), update and manufacture custom control and
automation systems for all classes of processes, systems and applications.
From cost effective printed
circuit board design and manufacture to full system design, build
and integration. Please contact MATECH to discuss your requirements.
A variety of services and structures
can be provided for the device, optoelectronic, optics, MEMS,
and microfabrication communities which fall well within MATECH’s
area of expertise and are too many to explicitly enumerate above.
Please call with your requirements and we will be glad to discuss
them with you.
