The WaveEtch™ family of tools is designed to handle the most demanding wafer thinning challenges. Substrates from 12" to a fraction of an inch can be thinned down with unparalleled accuracy and precision, and with the lowest TTV of any chemical thinning tool. The specifics of the process and minimum thickness attainable depends on the substrate type, diameter and structure. As an example, the WaveEtch™ can thin an unsupported (no tape, no carrier) 200 mm wafer down to 65 um routinely. Thinner wafers can be easily processed with tape or carriers. There are a variety of chucks available for the WaveEtch™ tools, including non-contact options. Please contact us to discuss the particulars of your processes. We will be happy to help.
More on WaveEtch™ thinning performance
Solar Cells Sawmark Removal
The WaveEtch™ tool is ideally suited for solar cell processing; from saw mark removal to surface texturing. The streamlining and consolidation of solar cell wet processes into a single, high throughput tool can eliminate manufacturing steps, thus reducing cost. Cell substrates can be smoothed out and stress relieved simultaneously while using less chemicals and with the option of using a different wet process on each side of the substrate. The WaveEtch™ Solar Tools range in throughput from 1000 to 3000 wafers per hour.
Solar Cell Texturing
Due to its LinearScan™ technology, the WaveEtch™ is capable of acid or basic surface texturing for increased optical efficiency at a reduced cost when compared to other alternatives, and with much greater control of the scale and nature of the features.
The unique combination of single-sidedness, LinearScan™ technology and megasonics is a very powerful cleaning solution. Virtually all contaminants; organics, glue residue, and particles, can be removed quickly and effectively without having to worry about protecting the non process side, and usually in a fraction of the time it takes to do it by conventional methods.
Megasonic Cleaning NEW!
The introduction of Megasonics processing and cleaning to the WaveEtch™ platform expands the realm of what is possible to do with wet processes. Most chemical interaction with the substrate occur much faster, increasing throughput and performance. In most cases the temperature of the process can be reduced while maintaining performance and throughput. Under other circumstances, stubborn reactions or film removal steps can go from difficult and time consuming to fast and easy. Rinse times of hydrophilic systems can be sped up manyfold. The coupling of megasonics energy also makes particle removal more effective and efficient. MATECH's megasonic technology works equally well on thick substrates (i.e. masks) as it does on ultra thin wafers.
The WaveEtch™'s LinearScan™ technology and transport effect decoupling usually results in improved patter uniformity, especially in fine structures such as gratings or other fine patterns. The addition of megasonics, under some circumstances, can also enhance the etch rates manyfold as well as improve uniformity at the same time.
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Stress relief is a native application for the WaveEtch™ technology. It is fast, inexpensive and simple. A few tens of microns can be removed in seconds to maximize substrate strength and dramatically improve overall device yield. Importantly, the WaveEtch™ does not cause any edge damage, such as that cause by many spinning systems, that may result in degraded strength and yield loss.
Oxide/Nitride film removal
Removal of silicon oxide and nitride is a simple, fast and cost effective application of the WaveEtch™. It takes seconds to strip, rinse, and dry the substrates while using a fraction of the chemicals and DI water that any other competitive system would. As an additional advantage, the removal can be completely single-sided without need to protecting the non-process side.
Oxide film removal details
Nitride film removal details